Current Revision
IPC-6018DS

IPC-6018DS: Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating of filled holes, copper filled microvias and therma shock. For use with IPC-6011 and IPC-6018. Supersedes IPC-6018CS.

Published Date
ISBN
978-1-63816-101-1
Pages
20
DoD Adopted
No
ANSI Approved
No

https://www.ipc.org/TOC/IPC-6018DS_TOC.pdf