Current Revision

IPC-DRM-18J: Component Identification Training and Reference Guide - English

Free Review

The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, computer graphics, schematic symbols and detailed descriptions of through-hole and surface mount components commonly used in electronics assembly today.

Contains updated info on SSOP, TSOP, QFP, LQFP, PQFP, LCC, QFN, and BGA-related packages, including all the variations within those groups.

New components include DFN, QFN – Multi Row, PoP (Package on Package), CSP (ChipScale Package), COB (Chip on Board), Bare Die and Flip Chip.

The Terminology Section has quick facts on polarity, orientation, lead styles and Component Reference Designators (CRDs). The "Reading Component Values" section has full-color, easy-to-use color code charts for resistors and inductors, as well as charts for reading numbered capacitor data. Contains 73 pages in a compact 5.5 x 8.5 inch (14 x 21.5cm) size. Released January, 2018.

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Published Date
DoD Adopted
ANSI Approved