Current Revision
IPC-4555

IPC-4555: Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

The IPC-4555 standard covers the requirements and testing for organic solderability preservatives (OSP) processes for printed boards to be used primarily for electrical and electronic circuits. Details for lead free soldering are covered in IPC-4555

Published Date
ISBN
978-1-63816-074-8
Pages
24
DoD Adopted
No
ANSI Approved
No