Current Revision

IPC-4563

IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.

Published Date
Pages
19
DoD Adopted
No
ANSI Approved
No