Current Revision

IPC-HDBK-001F1

J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1

This is an amendment to IPC J-STD-001F, a recognized industry-consensus standard covering materials and processes. Changes include, but are not limited to, a revision to plated-through hole, PTH, minimum fill requirements and BGA voiding criteria, new graphics for several surface mount component types, revised staking criteria, and recognition of the paragraphs addressed in J-STD-001FS, Space Applications Electronic Hardware Addendum to J-STD-001F.

This amendment must be used with J-STD-001F. See related items.

Published Date
ISBN
978-1-61193-222-5
Pages
16
DoD Adopted
No
ANSI Approved
No