Current Revision


SolMatFAM: Solder Materials Family

This is a family of specifications on soldering materials and solderability testing used in the printed board assembly processes.

J-STD-002 EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

J-STD-003 Solderability Tests for Printed Boards

J-STD-004 Requirements for Soldering Fluxes

J-STD-005 Requirements for Soldering Pastes

J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Published Date