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IPC Study of Quality Benchmarks for Electronics Assembly 2019

IPC Study of Quality Benchmarks for Electronics Assembly 2019

Document #:
Revision
2019
Product Type
Released:  07/31/2019
Language
English
Study of Quality Benchmarks for Electronics Assembly 2019 is a global survey-based study covering production data, yields, defect rates (DPMO), cost of rework and scrap, customer acceptance of reworked boards, test and inspection methods used, customer returns, supplier performance, customer satisfaction and certification data. Companies that assemble printed boards and other electronic products...
Document #:
Revision
2016
Product Type
Released:  09/12/2017
Language
English
This annual IPC report offers consensus estimates of PCB (bare board) production value by country and by product type, and commentary on global and regional PCB industry trends, developed by a team of the industry's leading analysts. It also contains historical data on regional PCB production trends. This year's report includes a special report on trends in high-speed data communications and its...