IPC-2221 - Revision B - Appendix A
IPC-2221B Appendix A Version 2.0 June 2018

Appendix A to IPC-2221B provides current test coupon designs as developed and maintained by the IPC 1-10c Test Coupon and Artwork Generation Task Group. These coupons are intended for qualification and conformance assessment to IPC-6010 printed board performance series specifications. This June 2018 version 2.0 file includes new coupon designs for propagated B and D structures for via evaluation, feature size and spacing, registration, thermal stress and rework simulation. The file also includes an update to the “W” surface mount solderability test coupon, a design currently under evaluation within IPC.

Published Date
DoD Adopted
ANSI Approved