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IPC-2223 Standard Only

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Document #:
Revision
E
Product Type
Released:  01/24/2020
Language
English
Current Revision
IPC-2223E used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. IPC-2223E provides new design...
Document #:
Revision
D
Product Type
Released:  09/20/2016
Language
English
Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision D provides new design guidance and...

IPC-2223 - Revision E - Standard Only

挠性和刚挠印制板设计分标准

Document #:
Revision
E
Product Type
Released:  08/10/2021
Language
Chinese
Current Revision
IPC-2223与IPC-2221一起使用时,IPC-2223确立了挠性印制板设计以及组件安装和互连结构形式的特定要求。 结构中使用的挠性材料由绝缘膜,增强和/或非增强电介质与金属材料组成。 IPC-2223E为制造图纸,孔到边的间距,弯曲区域的导体注意事项,刚性和挠性区域之间的介电厚度以及双行零插入力(ZIF)连接器提供了新的设计指南和要求

IPC-2223 - Revision A - Standard Only

Sectional Design Standard for Flexible Printed Boards

Document #:
Revision
A
Product Type
Released:  09/05/2007
Language
German
This is the German Language version of IPC-2223A.Used in conjunction with IPC-2221A, IPC-2223 establishes the requirements for the design of single-sided, double-sided, multilayer, or rigid-flex flexible circuits. Revision A includes updated design rules for panel sizes, hole spacing, bend radii, shielding, palletization, nonfunctional lands, coverlayer access/spacing and conductor edge spacing...