Menu
Close
Contact IPC

IPC-4552 Standard Only

Your results

  • 4

Language

Products

IPC 4552B Cover

IPC-4552 - Revision B - Standard Only

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

Document #:
IPC-4552
Revision
B
Product Type
Standard Only
Released:  07/27/2021
Language
English
Current Revision
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will...

IPC-4552 - Revision A - Standard Only

Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

Document #:
IPC-4552
Revision
A
Product Type
Standard Only
Released:  08/22/2017
Language
English
The IPC-4552A performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. The IPC-4552A is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM). The IPC-4552A standard may be...
no-image-available

IPC-4552B-Chinese - Standard Only

印制板化学镀镍/ 浸金（ENIG）镀覆性能规范

Document #:
IPC-4552
Revision
B
Product Type
Standard Only
Released:  10/17/2022
Language
Chinese
Current Revision
本性能规范为化学镀镍 / 浸金（ENIG）在包括焊接、金属线键合和作为一种接触表面的应用设置了相应的沉积厚度要求。适用于化学药水供应商、印制板制造商、电子制造服务业（EMS）和原始设备制造商（OEM）。本标准可用于除了那些符合 IPC-6010 系列（IPC-6012、IPC-6013 和 IPC-6018）标准性能要求外的指定的验收标准。使用本规范规定的化学镀镍 / 浸金（ENIG）沉积层也满足 J-STD-003 印制电路板的可焊性规范中涂层耐久性的最高等级要求。
IPC-4552A CN Cover Image

IPC-4552 - Revision A - Standard Only

印制板化学镀镍/ 浸金（ENIG)镀覆性能规范

Document #:
IPC-4552
Revision
A
Product Type
Standard Only
Released:  12/08/2021
Language
Chinese
IPC-4552A 性能规范设定了对化学镀镍/沉金 (ENIG) 沉积厚度的要求，这些应用包括焊接、引线键合和作为接触表面处理。 IPC-4552A 旨在供化学品供应商、印制板制造商、电子制造服务 (EMS) 和原始设备制造商 (OEM) 使用。 除了 IPC-6010-FAM 印制板性能规范中的要求外，IPC-4552A 标准还可用于指定验收标准以满足性能要求。 使用本文件指定的 ENIG 沉积物将满足 J-STD-003 印制板可焊性规范中指定的最高涂层耐久性等级。 IPC-4552A 规范基于三个关键因素： ENIG 电镀工艺受到控制，产生镍和金沉积厚度的正态分布。 用于测量沉积物并因此控制过程的工具对于指定的厚度范围是准确和可重复的。 ENIG 电镀工艺可实现均匀的沉积特性。 如果不满足这三个关键因素中的任何一个，则生产的沉积物将不符合定义的性能标准。
1 - 4 of 4

Coming Soon

IPC-7352: Generic Guideline for Land Pattern Design

IPC-4922: Requirements for Sintering Materials for Electronics Assembly

IPC-2591, Version 1.6: Connected Factory Exchange (CFX)

J-STD-005B: Requirements for Soldering Pastes

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-1791C: Trusted Electronic Designer, Fabricator and Assembler Requirements