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IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will...
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J-STD-001J: Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610J: Acceptability of Electronic Assemblies
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-4562B: Metal Foil for Printed Board Applications
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards