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IPC-7092 Standard Only

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Document #:
Revision
A
Product Type
Released:  11/28/2022
Language
English
Current Revision
IPC-7092A standard describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. IPC-7092A covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.
Document #:
Revision
Original Version
Product Type
Released:  02/18/2015
Language
English
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. It provides useful and practical information to decision makers of formed or placed, passive or active components and helps establish inspection techniques, testing processes, and reliability validations. Users will also learn...
Document #:
Revision
Original Version
Product Type
Released:  01/20/2020
Language
Chinese
Current Revision
本标准描述了在印制板中以成形或放置方式实现的有源和无源元器件在设计和组装方面的挑战。包括内部电子元器件的完整结构可用于表面贴装和/或通孔元器件连接。在组装过程中,多层结构变成准备为进一步加工的完整产品,它可由有机、无机(陶瓷)或两类兼有的材料制成。