Current Revision
IPC-9202 - Revision A - Standard Only
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly

The IPC-9202A, Material and Process Characterization/Qualification Test Protocol that records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions that grossly affect reliability.

It uses test vehicles that are intended to be representative of the electronic circuits that are in production. It is a test, yielding both quantitative and qualitative data.

The IPC-9202A test may be used for Process Qualification, demonstrating that a proposed manufacturing process or process change can produce hardware with acceptable end-item performance related to electrochemical risk. Changes may involve any assembly process step, or a change in the printed board supplier, solder mask or metallization, soldering material supplier, conformal coating, etc. The test vehicle construction will vary depending upon the type of change being evaluated.

Published Date
DoD Adopted
ANSI Approved