Your results
- 1
Language
Products
This publication is intended to characterize the frature strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow...
Coming Soon
J-STD-001J: Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610J: Acceptability of Electronic Assemblies
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-4562B: Metal Foil for Printed Board Applications
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards