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IPC-9702 Standard with amendment(s)

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Revision
Original Version
Released:  08/18/2015
Language
English
Current Revision
This publication is intended to characterize the frature strength of a component's board level-interconnect by providing a common method of establishing the fracture resistance to flexural loading that may occur during conventional non-cyclic board assembly and test operations. The document is applicable to surface mount components attached to printed wiring boards using conventional solder reflow...