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IPC-A-20/21 Gerber Files

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IPC-A-20/21 - Gerber Files

Standard Pitch Stencil Pattern for Slump

Document #:
IPC-A-20/21
Revision
Original Version
Product Type
Gerber Files
Released:  02/01/1996
Language
English
Current Revision
Provided electronically, these Gerber Files include patterns for developing solder paste stencils by laser or chemical etching. Land widths of 0.4 mm, 0.63mm and 1.25 mm are provided with varying pitch in order to evaluate solder paste slump. J-STD-005 included with each order. Available in Gerber data only.
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