Current Revision
IPC-APEX - Conference Presentations
IPC APEX 2019 Technical Conference Proceedings

The 2019 IPC APEX EXPO technical conference is one of the most outstanding in the electronics industry. Proceedings from this technical conference include: 98 presentations from 34 sessions, 20 poster papers and 5 buzz session presentations on Automation in Electronics Manufacturing, Adhesives, Advanced Technology, Area Array/Flip Chip/0201 Metric, Assembly and Rework Processes, BGA/CSP Packaging, Black Pad and Other Board Related Defect Issues, BTC/QFN/LGA Components, Business & Supply Chain Issues, Cleaning, Conformal Coatings, Corrosion, Counterfeit Electronics, Design, Electromigration, Electronics Manufacturing Services, Embedded Passive & Active Devices, Environmental Compliance, Graphene in Electronics Manufacturing, Lean Six Sigma, LED Manufacturing, Failure Analysis, Flexible Circuitry, HDI Technologies, Head-on-Pillow, Board and Component Warpage, High Speed, High Frequency & Signal, Industry 4.0, Integrity, Lead-Free Fabrication, Assembly & Reliability, Miniaturization Nanotechnology Optoelectronics, Packaging & Components, PCB Fabrication, PCB and Component Storage & Handling Performance, Quality & Reliability, Photovoltaics, PoP (Package-on-Package), Printed Electronics, Reshoring, RFID Circuitry, Robotics, Soldering, Surface Finishes, Test, Inspection & AOI, Tin Whiskers, 2.5-D/3-D Component Packaging, Underfills, Via Plugging & Other Protection and Wearables. These Proceedings are exclusively available as a download — NO HARD COPY IS AVAILABLE. Released May 2019.

Published Date
DoD Adopted
ANSI Approved