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IPC-FINFIN - White Paper

Final Finish for Connectivity

Document #:
Revision
Original Version
Product Type
Released:  01/18/2012
Language
English
Current Revision
"Final Finish for Connectivity" was presented by George Milad of Uyemura International Corporation at the IPC Conference for the PCB Industry: Critical Issues for the Military Market, in December 2011. The author describes surface finishes applied to printed circuit boards to enhance their reliability, solderability, shelf life and the applicability to wire bonding. He also mentions the IPC...