IPC-J-STD-005 - Standard with Amendment 1
Requirements for Soldering Pastes

This is the Chinese language version of J-STD-005.

DOD Adopted 1995Lists requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes are included. Supersedes QQ-S-571. Developed by IPC and EIA. 24 pages. Released January 1995.

Published Date
DoD Adopted
ANSI Approved