Current Revision
IPC-MIL - Roadmap
PWB Technology Roadmap

"PWB Technology Roadmap" was presented by Lance Auer, product development engineering, Raytheon Missile Systems Division, at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in Washington D.C., in December 2011.The author explores the developing challenges of PCB design. Design types, digital, power and high speed RF circuits present conflicting requirements of more layers and laminations, thin vs. thick copper, materials and testability. As components become smaller and pin counts increase with decreased pin pitch, layout nightmares can result. Reliability, design rules and suppliers are all ongoing concerns.This presentation includes synchronized audio and video files. 27 minutes. Released 2012.

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