This document contains a wide variety of photographic illustrations of various anomalies and characteristics of printed boards for identification of anomalies that are sometimes seen during inspection and evaluation processes. The handbook has been divided into fourteen distinct sections covering topics such as solder resist, plated-through holes, conductor characteristics and surface plating to...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards