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Findings from a 2017 IPC survey of U.S. electronics assembly manufacturers on the impact of the skills gap covers hard-to-fill production and professional positions, reasons applicants did not qualify, and essential skills in short supply. Published April 2017. 31 pages
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards