Current Revision
IPC-SPVC - White Paper
Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots
The IPC Solder Products Value Council’s Technical Subcommittee Report “Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots” reports on research on take action limits of solder pot contamination for SAC305 lead-free solder.
As opposed to one maximum contamination level, the IPC SPVC opted to identify three action levels:
This report is free for IPC members.
The 27 page research report provides the analysis of all the wetting and ring testing and provides a proposed recommendation of take action limits for contamination levels. Released November 2009.
Published Date
DoD Adopted
No
ANSI Approved
No