Current Revision
IPC-SPVC - White Paper
Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots

The IPC Solder Products Value Council’s Technical Subcommittee Report “Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots” reports on research on take action limits of solder pot contamination for SAC305 lead-free solder.

As opposed to one maximum contamination level, the IPC SPVC opted to identify three action levels:

  • Normal operation defined as the level one would expect contamination levels to be based on running steady state.
  • Increased Monitoring defined as a level that is not a danger but a level that indicates an upward trend that should be monitored more closely.
  • Adjust Pot defined as the level at which pot should be adjusted to insure reliable performance of the solder joints.

    This report is free for IPC members.

    The 27 page research report provides the analysis of all the wetting and ring testing and provides a proposed recommendation of take action limits for contamination levels. Released November 2009.

    • Published Date
    DoD Adopted
    No
    ANSI Approved
    No