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There are a large number of new lead-free alloys that address the manufacturing problems inherent in current lead-free products on the market. However, their reliability properties are less understood than many of the first alloys introduced, for example SAC 305. While it is tempting to look to the new alloys as solutions to manufacturing issues of the older materials, the lack of reliability...
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IPC-2221C: Generic Standard on Printed Board Design
J-STD-001J: Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610J: Acceptability of Electronic Assemblies
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J-STD-005B: Requirements for Soldering Pastes
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