Products
The IPC/DAC-2552 standard was developed jointly with the Digital Association of China (DAC), with the purpose to use Model Based Definition (MBD) to realize efficient and high-quality digital design of board-level assembly, support electronic assembly virtual manufacturing, and enabling the digitalization from requirement to product realization for printed board assemblies. The IPC/DAC-2552...
Coming Soon
J-STD-001J: Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610J: Acceptability of Electronic Assemblies
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-4562B: Metal Foil for Printed Board Applications
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards