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The IPC-HERMES-9852 is an open industry standard, developed by the Hermes Standard Initiative and approved by IPC. The IPC-HERMES-9852 provides a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology. Specifically, IPC-HERMES-9852, version 1.5 provides additional alignment with IPC-2591 (IPC-CFX). Used with IPC-2591, Connected Factory Exchange...
The IPC-Hermes-9552 v. 1.4 is an open industry standard, developed by The Hermes Initiative and approved by IPC. The IPC-Hermes-9542 provide a state-of-the-art communication protocol for machine-to-machine communication for surface-mount technology (SMT). Specifically, IPC-HERMES-9852, version 1.4 provides additional alignment with IPC-2591 (IPC-CFX). Used with IPC-2591, Connected Factory Exchange...
IPC-HERMES-9852 an open industry standard, developed by The Hermes Standard Initiative and approved by IPC, provides a state-of-the-art communication protocol for machine-to-machine communication between equipment units in electronics assembly lines for surface-mount technology (SMT). Thus IPC-HERMES-9852 represents a next generation standard to the technology documented in IPC-SMEMA-9851...
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IPC-2221C: Generic Standard on Printed Board Design
J-STD-001J: Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610J: Acceptability of Electronic Assemblies
IPC-4922: Requirements for Sintering Materials for Electronics Assembly
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-4562B: Metal Foil for Printed Board Applications
IPC-7711/21D: Rework, Modification and Repair of Electronic Assemblies