630 Products

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A-610GC-Telecom: Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies

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IPC-9121-AM2: Troubleshooting for Printed Board Fabrication Processes, Amendment 2

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IPC-WP-026: IPC Technology Solutions White Paper on Blockchain and the Electronics Industry: A Review of...

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IPC-8921: Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns...

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IPC-1072-AM1: Intellectual Property Protection in Electronic Assembly Manufacturing

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IPC-4556-AM1: is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendment...

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IPC-6013D-AM1: Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards

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IPC-1791-AM1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

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Nonmember: $58.00

IPC-9121-AM1: Troubleshooting for PCB Fabrication Processes, Amendment 1

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IPC-4412B-AM2: Specification for Finished Fabric Woven from “E” Glass for Printed Boards

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J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-6012D-AM1: Qualification and Performance Specification for Rigid Printed Boards

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IPC-2019 Annual Report and Forecast for the North American EMS Industry

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2019 Analysis & Forecast for the North American EMS Industry

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Nonmember: $900.00

IPC-2019 Annual Report and Forecast for the North American EMS Industry

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IPC-2019 World Cable Assembly Market

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IPC-2019 Annual Report on the North American PCB Industry

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IPC-2019 Annual Report on the North American PCB Industry

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IPC Study of Quality Benchmarks for Electronics Assembly 2019

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IPC-Study of Quality Benchmarks for Electronics Assembly 2019

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IPC-Study of Quality Benchmarks for Electronics Assembly 2019

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IPC-WP-019A: IPC-WP-019A / An Overview on the Global Change in Ionic Cleanliness Requirements

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IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

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IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1