725 Products

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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirements

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IPC/PERM-WP-022: Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry...

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IPC-WP-024: IPC White Paper on Reliability and Washability of Smart Textile Structures – Readiness for...

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IPC-9252A-AM1: Requirements for Electrical testing of Unpopulated Printed Boards

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IPC-7711-21B-Change1: Procedures are additions to the IPC-7711B/7721B

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IPC-6013B-Errata: This is a list of reported errata to the printed copies of IPC-6013B

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IPC-4821-AM1: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

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IPC-4562A-AM1: Metal Foil for Printed Board Applications

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IPC-4554-AM1: Specification for Immersion Tin Plating for Printed Circuit Boards

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IPC-4552-AM2: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 2

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IPC-4552-AM1: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Amendment 1

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IPC-9503: Moisture Sensitivity Classification for Non-IC Components

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IPC-Study of Quality Benchmarks for Electronics Assembly 2018

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IPC-2221B Appendix A Version 2.0 June 2018

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IPC-4412B-AM1: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

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IPC-4204A-AM1: Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-4203A-AM1: Cover and Bonding Material for Flexible Printed Circuitry

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IPC-4202A-AM2: Flexible Base Dielectrics for Use in Flexible Printed Circuitry

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IPC-4202A-AM1: Flexible Base Dielectrics for Use in Flexible Printed Circuitry

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IPC-4103-AM1: Specification for Base Materials for High Speed/High Frequency Applications

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IPC-2141A-Errata List

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IPC-1752A-Errata

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IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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APEX-EXPO18: IPC APEX 2018 Technical Conference Proceedings