IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes
IPC-DRM-18J: Component Identification Training and Reference Guide - English
FUTUREELE-IRVINE1-11: Future of Printed Electronics
EXESUM10-10-TECHPACK: Technology Package
EXESUM10-10-ECONOMIC: Effects of 2010 global economics on competition in the PCB and electronics manufacturing services...
MEANPCB-IRVINE-01-11: Printed Electronics: What Does It Mean for the Printed Circuit Board Industry?
ADVELECPK-IRVINE1-11: Manufacturing opportunities and challenges for printing of advanced electronic packaging
MILCERT-0915: Trends in Military Certifications: What You Need to Know About the Obvious and the...
THERMMIL-11-10-CA: Military Electronics Cooling and Thermal Management Issues: Moving Away From COTS
TINWHISKER-12-10-IL: Tin Whiskers: Heroics or Hysteria - Where is the Middle Ground?
TINCONFCOAT-12-10-IL: Long Term Investigation of Urethane Coating Against Tin Whisker Growth
IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies
IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects
JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products
FLEXFUTURE-MN06-11: Keynote: the Future of Flex: Opportunities and Challenges
FLEXMAN-MN06-11: Staying Flexible with Manufacturing when the Military is in Flux
IPC-9850A: Surface Mount Placement Equipment Characterization
EXESUM10-11-SUPCHAIN: Coping in an Era of Uncertainty - An Increasingly Agile Supply Chain and...
PLASMA-IRVINE-11-11: Use of Plasma Deposition to Provide a Novel Surface Finish and Protective Coating for...
UNDERFIL-IRVINE11-11: Underfill Selection and the Impact on Reliability
IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-T-50J: SUPERSEDED BY T-50K