Publications

3 Products

Member: $66.00

Nonmember: $131.00

IPC-TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning...

Member: $41.00

Nonmember: $82.00

SMC-WP-003: Chip Mounting Technology

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Nonmember: $131.00

TR-464: Accelerated Aging for Solderability Evaluations