Publications

5 Products

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IPC-TR-486: Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning...

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SPVC-TAL1: Take Action Limits (TAL) for SAC305 Lead Free Soldering Processes Utilizing Solder Baths/Pots

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EMBPASWP309: An IPC White Paper: Embedded Passives: An Overview of Implementation, Benefits and Costs

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COMPTRACE-0609: What You Can Do About Component Traceability

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WP-009: A Summary of Tin Whisker Research References