29 Products

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World PCB Production Report for the Year 2017

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IPC-WP-019A: An Overview on the Global Change in Ionic Cleanliness Requirements

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IPC-2018 Annual Report - North American PCB Industry

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IPC-Study of Quality Benchmarks for Electronics Assembly 2018

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2017 Wage Rate & Salary Study for the North American Electronics Assembly Industry

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IPC-2018 Annual Report and Forecast for the North American EMS Industry

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IPC/PERM-WP-022: Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry...

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IPC-WP-024: IPC White Paper on Reliability and Washability of Smart Textile Structures – Readiness for...

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IPC-Study of Quality Benchmarks for Electronics Assembly 2018

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APEX-EXPO18: IPC APEX 2018 Technical Conference Proceedings

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IPC-2018 Annual Report on the North American PCB Industry - Single User

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FUTUREELE-IRVINE1-11: Future of Printed Electronics

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EXESUM10-10-TECHPACK: Technology Package

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EXESUM10-10-ECONOMIC: Effects of 2010 global economics on competition in the PCB and electronics manufacturing services...

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MEANPCB-IRVINE-01-11: Printed Electronics: What Does It Mean for the Printed Circuit Board Industry?

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ADVELECPK-IRVINE1-11: Manufacturing opportunities and challenges for printing of advanced electronic packaging

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THERMMIL-11-10-CA: Military Electronics Cooling and Thermal Management Issues: Moving Away From COTS

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TINWHISKER-12-10-IL: Tin Whiskers: Heroics or Hysteria - Where is the Middle Ground?

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TINCONFCOAT-12-10-IL: Long Term Investigation of Urethane Coating Against Tin Whisker Growth

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FLEXFUTURE-MN06-11: Keynote: the Future of Flex: Opportunities and Challenges

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FLEXMAN-MN06-11: Staying Flexible with Manufacturing when the Military is in Flux

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EXESUM10-11-SUPCHAIN: Coping in an Era of Uncertainty - An Increasingly Agile Supply Chain and...

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PLASMA-IRVINE-11-11: Use of Plasma Deposition to Provide a Novel Surface Finish and Protective Coating for...

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UNDERFIL-IRVINE11-11: Underfill Selection and the Impact on Reliability