70 Products

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IPC-2019 Annual Report on the North American PCB Industry

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IPC-2018 Annual Report - North American PCB Industry

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IPC-Study of Quality Benchmarks for Electronics Assembly 2018

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2017 Wage Rate & Salary Study for the North American Electronics Assembly Industry

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IPC-2018 Annual Report and Forecast for the North American EMS Industry

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IPC/PERM-WP-022: Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry...

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IPC-WP-024: IPC White Paper on Reliability and Washability of Smart Textile Structures – Readiness for...

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IPC-Study of Quality Benchmarks for Electronics Assembly 2018

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IPC-2018 Annual Report on the North American PCB Industry - Single User

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APEX-EXPO18: IPC APEX 2018 Technical Conference Proceedings

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PCB Technology Trends 2016 (Single User)

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Findings on the Skills Gap in U.S. Electronics Manufacturing (Single User)

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IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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TW0412-STATELEAD: Welcome and Introduction: the State of Lead-Free Address

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TW0412-ENVIRON: Tin Whisker Inorganic Coatings Evaluation (TWICE)

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TW0412-MAGMORPH: Y-12 Lead-Free Solder Technologies

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EXESUM10-11-SUPCHAIN: Coping in an Era of Uncertainty - An Increasingly Agile Supply Chain and...

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PLASMA-IRVINE-11-11: Use of Plasma Deposition to Provide a Novel Surface Finish and Protective Coating for...

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UNDERFIL-IRVINE11-11: Underfill Selection and the Impact on Reliability

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EXESUM10-11-FUTUREEM: Future of the EMS Industry and Its Impact on the PCB Industry

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EXESUM10-11-DISASTER: Disaster Preparedness: Strategies for Mitigating Supply Chain Disruption

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EXESUM10-11-CONFMIN: Conflict Minerals - Celestica Perspective

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FLEXFUTURE-MN06-11: Keynote: the Future of Flex: Opportunities and Challenges

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FLEXMAN-MN06-11: Staying Flexible with Manufacturing when the Military is in Flux