FUTUREELE-IRVINE1-11: Future of Printed Electronics
EXESUM10-10-TECHPACK: Technology Package
EXESUM10-10-ECONOMIC: Effects of 2010 global economics on competition in the PCB and electronics manufacturing services...
MEANPCB-IRVINE-01-11: Printed Electronics: What Does It Mean for the Printed Circuit Board Industry?
ADVELECPK-IRVINE1-11: Manufacturing opportunities and challenges for printing of advanced electronic packaging
ENVSYM0710: Proceedings from the IPC Conference It’s Not Easy Being Green: UNDERSTANDING PROLIFERATING CHEMICAL AND...
TIC09-PCBMILRDMP: North American PCB Military Technology Roadmap
TIC09-HDIAERO: HDI Implementation for Aerospace/Military Applications
TIC09-COMMILMFG: Integration of Commercial and Military Manufacturing
EXMG0410-lean: The Lean Surface Mount Line
EXMG0410-costactg: How Does Cost Accounting Impact Pricing
EXMG0410-consol: Are the Consequences of Industry Consolidation Good or Bad
THERMMIL-11-10-CA: Military Electronics Cooling and Thermal Management Issues: Moving Away From COTS
TINWHISKER-12-10-IL: Tin Whiskers: Heroics or Hysteria - Where is the Middle Ground?
TINCONFCOAT-12-10-IL: Long Term Investigation of Urethane Coating Against Tin Whisker Growth
EXMT10-AUTO: Automotive Electronics in Harsh Environment
EXMT10-COST: Analysis of the Cost Impact of Supplying High-Reliability Products
FLEXFUTURE-MN06-11: Keynote: the Future of Flex: Opportunities and Challenges
FLEXMAN-MN06-11: Staying Flexible with Manufacturing when the Military is in Flux
HALFREE107-CD: Intel/IPC Halogen Free Symposium
ENVSYM0511: It's Not Easy Being Green: Roadmap to Compliance Proceedings
EXESUM10-11-SUPCHAIN: Coping in an Era of Uncertainty - An Increasingly Agile Supply Chain and...
PLASMA-IRVINE-11-11: Use of Plasma Deposition to Provide a Novel Surface Finish and Protective Coating for...
UNDERFIL-IRVINE11-11: Underfill Selection and the Impact on Reliability