Publications: Proceedings

31 Products

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FUTUREELE-IRVINE1-11: Future of Printed Electronics

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EXESUM10-10-TECHPACK: Technology Package

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EXESUM10-10-ECONOMIC: Effects of 2010 global economics on competition in the PCB and electronics manufacturing services...

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MEANPCB-IRVINE-01-11: Printed Electronics: What Does It Mean for the Printed Circuit Board Industry?

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ADVELECPK-IRVINE1-11: Manufacturing opportunities and challenges for printing of advanced electronic packaging

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ENVSYM0710: Proceedings from the IPC Conference It’s Not Easy Being Green: UNDERSTANDING PROLIFERATING CHEMICAL AND...

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TIC09-PCBMILRDMP: North American PCB Military Technology Roadmap

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TIC09-HDIAERO: HDI Implementation for Aerospace/Military Applications

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TIC09-COMMILMFG: Integration of Commercial and Military Manufacturing

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EXMG0410-lean: The Lean Surface Mount Line

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EXMG0410-costactg: How Does Cost Accounting Impact Pricing

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EXMG0410-consol: Are the Consequences of Industry Consolidation Good or Bad

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THERMMIL-11-10-CA: Military Electronics Cooling and Thermal Management Issues: Moving Away From COTS

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TINWHISKER-12-10-IL: Tin Whiskers: Heroics or Hysteria - Where is the Middle Ground?

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TINCONFCOAT-12-10-IL: Long Term Investigation of Urethane Coating Against Tin Whisker Growth

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EXMT10-AUTO: Automotive Electronics in Harsh Environment

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EXMT10-COST: Analysis of the Cost Impact of Supplying High-Reliability Products

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FLEXFUTURE-MN06-11: Keynote: the Future of Flex: Opportunities and Challenges

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FLEXMAN-MN06-11: Staying Flexible with Manufacturing when the Military is in Flux

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HALFREE107-CD: Intel/IPC Halogen Free Symposium

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ENVSYM0511: It's Not Easy Being Green: Roadmap to Compliance Proceedings

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EXESUM10-11-SUPCHAIN: Coping in an Era of Uncertainty - An Increasingly Agile Supply Chain and...

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PLASMA-IRVINE-11-11: Use of Plasma Deposition to Provide a Novel Surface Finish and Protective Coating for...

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UNDERFIL-IRVINE11-11: Underfill Selection and the Impact on Reliability