SPVC-LAT1: Analytical Procedures for Portable Lead-Free Alloy Test Data
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IPC-WP-012: Pb-free Electronics Risk Management (PERM) Council Pb-free Research Priorities
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WP-013: Analytical Procedures for Portable Lead-Free Alloy Test Data
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WP-014: Pb-free Electronics Risk Management (PERM) Council Position on the Use of Pb-free Electronics in...
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MILMKT12-11-FINFIN: Final Finish for Connectivity
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MILMKT12-11-PWBTECHR: PWB Technology Roadmap
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MILMKT12-11-RFPDOA: Is Your RFP D.O.A.
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MILMKT12-11-TECRDMP: Technology Roadmap for Aerospace & Defense Electronics Assembly Industry
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EMBPASWP309: An IPC White Paper: Embedded Passives: An Overview of Implementation, Benefits and Costs
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TPP-2016: Trade Agreements' Impact on the Electronics Industry
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WP-015: Pb-free Electronics Risk Management (PERM) Council Re-baseline of the Lead-Free Manhattan Project
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IPC-WP-116: Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control Plan
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IPC-WP-114: Guidance for the Development and Implementation of a White Plague Control Plan (WPCP)
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IPC-WP-113: Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP)
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WP-016: IPC Round Robin Study: Conformal Coatings - Moisture and Insulation Resistance and Dielectric Withstanding...
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IPC-WP-017: What Conformal Coaters Wish Designers Knew About Coatings
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IPC-WP-1081: White Paper on Conflict Minerals Due Diligence Guidance
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ROADMAP-15: IPC International Technology Roadmap for Electronic Interconnections-2015
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ROADMAP-15: IPC International Technology Roadmap for Electronic Interconnections-2015
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COMPTRACE-0609: What You Can Do About Component Traceability
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IPC-WP/TR-584A: IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in...
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WP-009: A Summary of Tin Whisker Research References
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MILMKT12-11-EMBCAP: Embedded Capacitor Technology; Status, Opportunity and Challenges
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IPC-WP-116: Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control Plan