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This document establishes the general requirements for documentaiton necessary to fully describe end product printed boards, regardless of raw material, special fabrication requirements, layer count or end product usage.
This standard provides guidance, general information and descriptions of proven techniques for assembly and soldering electronic assemblies.
This standard provides guidelines for accelerated reliability testing of surface mount solder attachments when evaluating and extrapolating the results of these tests towards actual use environments of electronic assemblies.
This standard sets requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards.
This standard identifies the moisture sensitivity classification level of passive surface mount devices and through-hole components, subjected to reflow soldering, so that they can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during assembly solder reflow attachment and/or repair operation.