IPC-A-610H: Acceptability of Electronic Assemblies - Multi Device License

IPC-A-600K: Acceptability of Printed Boards - Multi Device License

IPC-6012ES: Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid...

IPC-6012E: Qualification and Performance Specification for Rigid Printed Boards - Multi Device License

IPC/WHMA-A-620D: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC/JEDEC J-STD-033D: Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

IPC-J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

IPC-A-610G: Acceptability of Electronic Assemblies - Multi Device License

IPC-A-610G: Aceptabilidad de ensambles electrónico

IPC-A-610G:Acceptabilité des Assemblages Électroniques

IPC-A-610G: Abnahmekriterien für elektronische Baugruppen

IPC-J-STD-001G: Provee requisitos para materiales de soldadura y procesos para ensambles

IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards - Multi Device License

IPC-7711/21C: Rework, Modification and Repair of Electronic Assemblies

IPC-7711/21C:Reparación, Modificación y Reparación de Ensambles Electrónicos

IPC/WHMA-A-620C-FR: Exigences et Critères d’Acceptabilité pour l’Interconnexion des Faisceaux de Fils et de Câbles

IPC-WHMA-A-620C: Requisitos y Aceptabilidad de Cables y Mazos de Cables

IPC-A-600J: Acceptability of Printed Boards

IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

IPC-AJ-820A: Assembly & Joining Handbook

IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials