IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC-J-STD-075-Spanish: Clasificación de componentes electrónicos no-IC para procesos de ensamble

IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

IPC-7095C-CN: BGA设计与组装工艺的实施

IPC-A-610F: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์

J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

J-STD-001F-KR: 솔더링된 전기 및 전자 어셈블리에 대한 요건들

IPC-A-610F-KR: 전자 어셈블리에 대한 허용 가능성

IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

IPC-A-600G-SW: Acceptability of Printed Boards

IPC-6012B-SW: Qualification and Performance Specification for Rigid Printed Boards

IPC-A-610F-RO: Acceptabilitatea Ansamblurilor Electronice

J-STD-001F-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

IPC-A-610F-PL: Dopuszczalność Zespołów Elektronicznych

J-STD-001F-JP: はんだ付される電気及び電子組立品に関する要件事項

A-610DJP(D)1: Acceptability of Electronic Assemblies

J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

J-STD-004A-JP: Requirements for Soldering Fluxes

J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies