70 Products

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1

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4562A-CN: 印制板用金属箔

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IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink

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IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

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J-STD-004A-JP: Requirements for Soldering Fluxes

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J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-600G-JP/EK: Acceptability of Printed Boards

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7095B(D)1: Design and Assembly Process Implementation for BGAs

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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A-610DJP(D)1: Acceptability of Electronic Assemblies

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IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline

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IPC-7711/21B-HU: Elektronikai szerelvények újramunkálása, módosítása és javítása

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IPC-7711/21B-CZ: Přepracování, modifikace a opravy elektronických sestav

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IPC-7711/21B-CN: 电子组件的返工、修改和维修

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IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

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IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

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IPC-6011: Generic Performance Specification for Printed Boards

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IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives

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IPC-A-311: Process Controls for Phototool Generation and Use