IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-2291: Design Guideline for Printed Electronics

IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-9641: High Temperature Printed Board Flatness Guideline

IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC-5703: Cleanliness Guidelines for Printed Board Fabricators

IPC-7095C: Design and Assembly Process Implementation for BGAs

IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry

IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

IPC-4761: Design Guide for Protection of Printed Board Via Structures

IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

IPC-HDBK-005: Guide to Solder Paste Assessment

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

2221A: Generic Standard on Printed Board Design