J-STD-004B-CN: 修订本 1 助焊剂要求
21 Products
T-50H-CN: 电子电路互连与封装术语及定义
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610DC-Telecom Addendum
IPC/WHMA-A-620A-PL: Rev A superseded by Rev B
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
A-600GPL(D)1: Acceptability of Printed Boards
IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline
9702-CN: 板极互连的单向弯曲特性描述
IPC-2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards
IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies
IPC-CM-770E: Component Mounting Guidelines for Printed Boards
IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies
IPC-2615: Printed Board Dimensions and Tolerances
IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications
IPC-D-422: Design Guide for Press Fit Rigid Printed Board Back Planes