IPC-A-610DC-Telecom Addendum

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

A-600GPL(D)1: Acceptability of Printed Boards

IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

9702-CN: 板极互连的单向弯曲特性描述

J-STD-004B-CN: 修订本 1 助焊剂要求

J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

T-50H-CN: 电子电路互连与封装术语及定义

IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies

IPC-CM-770E: Component Mounting Guidelines for Printed Boards

IPC-D-422: Design Guide for Press Fit Rigid Printed Board Back Planes

IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies

IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

IPC-2615: Printed Board Dimensions and Tolerances

IPC-2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices