60 Products

Member: $43.00

Nonmember: $86.00

IPC-9204: 印刷电子柔性与可拉伸性能测试指南

Member: $79.00

Nonmember: $158.00

IPC-7530A: 群焊工艺温度曲线指南(再流焊和波峰焊

Member: $84.00

Nonmember: $168.00

IPC-A-640: 光纤,光缆和混合线束组件的验收要求

Member: $47.00

Nonmember: $93.00

IPC-4921A: 印刷电子基材(基板)要求

Member: $47.00

Nonmember: $95.00

IPC-6903A: 印刷电子设计与生产的术语及定义

Member: $68.00

Nonmember: $137.00

IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

Member: $79.00

Nonmember: $155.00

IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC-4101E: 刚性及多层印制板用基材规范

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Nonmember: $0.00

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

Member: $84.00

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IPC-J-STD-001G: 焊接的电⽓和电⼦组件要求

Member: $100.00

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IPC-A-610G: 电⼦组件的可接受性 - Chinese

Member: $68.00

Nonmember: $137.00

IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

Member: $131.00

Nonmember: $263.00

IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

Member: $158.00

Nonmember: $315.00

IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

Member: $100.00

Nonmember: $200.00

IPC/WHMA-A-620C:线缆及线束组件的要求与验收 - Chinese

Member: $84.00

Nonmember: $168.00

IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

Member: $100.00

Nonmember: $200.00

IPC-A-610G: Acceptability of Electronic Assemblies

Member: $84.00

Nonmember: $168.00

J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

Member: $84.00

Nonmember: $168.00

IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

Member: $221.00

Nonmember: $441.00

IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

Member: $84.00

Nonmember: $168.00

IPC-7095C-CN: BGA设计与组装工艺的实施