IPC-2591-Version 1.1: Connected Factory Exchange (CFX)

IPC-8921: Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns...

IPC-9121-AM2: Troubleshooting for Printed Board Fabrication Processes, Amendment 2

IPC-2591: 互联工厂数据交换（CFX）

IPC-HERMES-9852: 表面贴装技术组装中机器对机器通信的全球标准

IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

IPC-2231: 卓越设计（DFX）指南

IPC-2231: DFX Guidelines

IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

IPC-2591: Connected Factory Exchange (CFX)

IPC-9111: 印制电路板组装工艺的故障排除

IPC-9111:Troubleshooting for Printed Board Assembly Processes

IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards

IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

IPC-1601-CN: 印制板操作和贮存指南

IPC-A600H-Errata: IPC-A-600H Errata Information

IPC-7351B: 表面贴装设计及连接盘图形标准通用要求

IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten