IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC-HM-860: Specification for Multilayer Hybrid Circuits

IPC-D-354: Library Format Description for Printed Boards in Digital Form

C-406: Design & Application Guidelines for Surface Mount Connectors

A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

IPC-2615: Printed Board Dimensions and Tolerances

IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

2221A: Generic Standard on Printed Board Design

IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-9641: High Temperature Printed Board Flatness Guideline

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

IPC-2291: Design Guideline for Printed Electronics

IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

IPC-5703: Cleanliness Guidelines for Printed Board Fabricators