IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

IPC-HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Amendment 1

D-390A: Automated Design Guidelines

IPC-SM-780: Component Packaging & Interconnecting with Emphasis on Surface Mounting

IPC-A-610D WAM1: Acceptability of Electronic Assemblies

IPC-8497-1: Cleaning Methods and Contamination Assessment for Optical Assembly

IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

IPC-9850A: Surface Mount Placement Equipment Characterization

IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

IPC-T-50J: SUPERSEDED BY T-50K

IPC-7525B: Stencil Design Guidelines

IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components