IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings
27 Products
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Member: $84.00 Nonmember: $168.00
IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies
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IPC-2291: Design Guideline for Printed Electronics
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IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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IPC-9641: High Temperature Printed Board Flatness Guideline
Member: $65.00 Nonmember: $131.00
IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
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IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B
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IPC-5703: Cleanliness Guidelines for Printed Board Fabricators
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IPC-7095C: Design and Assembly Process Implementation for BGAs
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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry
Member: $84.00 Nonmember: $168.00
IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...
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J-STD-075: Classification of Non-IC Electronic Components for Assembly Processes
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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
Member: $47.00 Nonmember: $93.00
IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink
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IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
Member: $63.00 Nonmember: $119.00
7095B(D)1: Design and Assembly Process Implementation for BGAs
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IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline
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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
Member: $65.00 Nonmember: $131.00
IPC-2615: Printed Board Dimensions and Tolerances
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IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications