D-859: Design Standard for Thick Film Multilayer Hybrid Circuits
8 Products
Member: $66.00 Nonmember: $131.00
Member: $66.00 Nonmember: $131.00
IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards
Member: $47.00 Nonmember: $93.00
JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
Member: $84.00 Nonmember: $168.00
IPC-HDBK-005: Guide to Solder Paste Assessment
Member: $47.00 Nonmember: $93.00
IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
Member: $47.00 Nonmember: $93.00
IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices
Member: $66.00 Nonmember: $131.00
IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
Member: $84.00 Nonmember: $168.00
IPC-4761: Design Guide for Protection of Printed Board Via Structures