23 Products

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-A-610E-PL: Dopuszczalność Zespołów Elektronicznych

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J-STD-001E-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

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IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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IPC-A-610E: Acceptability of Electronic Assemblies

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards

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IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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IPC-9850A: Surface Mount Placement Equipment Characterization

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IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

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IPC-T-50J: SUPERSEDED BY T-50K

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IPC-7525B: Stencil Design Guidelines

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IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components