IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing
IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations
IPC-4103 WAM1 - AM2: Amendment 2 to Specification for Base Materials for High Speed/High Frequency...
J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1
IPC-6903: Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
IPC-6012D-Redline: Qualification and Performance Specification for Rigid Printed Boards-Red Line
IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...
IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards
IPC/JPCA-6901: Application Categories for Printed Electronics
IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-7801: Reflow Oven Process Control Standard
IPC-7092: Design and Assembly Process Implementation for Embedded Components
IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings
IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-2291: Design Guideline for Printed Electronics
IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-9641: High Temperature Printed Board Flatness Guideline
IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B