80 Products

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IPC-A-610D-CZ: Acceptability of Electronic Assemblies

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J-STD-075-CN: 组装工艺中非IC电子元器件的分级

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4562A-CN: 印制板用金属箔

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IPC-7711/21B-CN: 电子组件的返工、修改和维修

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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求

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IPC-9262: Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment 组装行业应用之AOI设备的特性描述与鉴定

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J-STD-001F-WAM1-CN: 焊接的电气和电子组件要求修订版F附修订本1

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IPC-A-600J-CN: 印制板的可接受性

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IPC-7530-CN: 群焊工艺温度曲线指南(再流焊和波峰焊)

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J-STD-001FS-CN: 焊接的电气和电子组件要求航天应用电子部件补充标准

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IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件

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T-50M-CN(D)1: 电子电路互连与封装术语及定义

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IPC-9252A-CN: 未组装印制板电气测试要求

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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J-STD-005-CN WAM1: Requirements for Soldering Pastes - includes Amendment 1

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IPC-CC-830B-CN WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos

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IPC-A-600J-SP: Aceptabilidad de Tableros Impresos

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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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7351A-DE: SUPERSEDED BY 7351B-DE

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IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

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IPC-A-600J-DE: Abnahmekriterien für Leiterplatten