38 Products

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IPC/WHMA-A-620 Test Data Tables

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IPC/WHMA-A-620B-Redline

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/JEDEC J-STD-609A Errata Information

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-A-610E-KR: 전자 어셈블리의 허용 가능성

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IPC/WHMA-A-620B-KR: 케이블과 와이어 하네스 어셈블리들에 대한 요건들과 수용

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IPC-A-610E-FR: Acceptabilité des assemblages électroniques

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IPC-2221B-FR: Norme Générique de Conception du Circuit imprimé

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IPC-2222A-FR: Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides

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IPC/WHMA-A-620B-FR: Exigences et critères d'acceptabilité pour l'interconnexion des faisceaux de fils et de câbles

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J-STD-001E-FR: Exigences des Assemblages Electriques et Electroniques Brasés

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A-620A-FR: Exigences et critères d’acceptation pour l’assemblage des câbles et faisceaux de câbles

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-2221B-DE: Basisrichtlinie für das Design von Leiterplatten

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IPC/WHMA-A-620B-DE: Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile

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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen

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D-310C: Guidelines for Phototool Generation and Measurement Techniques